Layer Count：

2-36 Layer

Board Thickness：

0.21-6.0mm

finished dimension：

0.8*1.2- 23*35 inch

Surface finishing：

Tin/Lead，HASL Lead free，Immersion Gold，Immersion Tin，Immersion Silver OSP, Gold Finger, Hard Gold Plating, Carbon, Peelable Mask

Base Substrate：

FR4，High TG FR4，High Frequency（Rogers, Arlon, Nelco），Halogen Free，Polyimide，BT and the mixed material lamination，Copper base board, Aluminum base board

Solder mask Color：

Green, White, Blue, Red, Yellow, Black, Matte Green, Purple,

Silkscreen Color：

White, Blue, Black, Gray, Yellow, Red

E-test：

100% E-test，Impedance Test，Thermal stress Test，High-Voltage Resistance Test, Ionic Contamination Test, Solderability Test, Microsection Analysis Test, Insulation Resistance Test

Max. Copper thickness：

8OZ

Max. Aspect Ratio：

16:1

Min. Warp/Twist：

0.20%

Min. Trace Width/Gap ：

3/3mil

Min. Hole size：

0.2mm

Min. solder mask bridge：

3.5mil